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多项目晶圆服务

  The XMC Multi-Project Wafer(MPW) program provides customers a cost-effective prototyping service by enabling multiple customers and projects to share common masks and engineering wafers.

  Currently, XMC provides shuttle service for 55nm LP logic, 55nm RF, 55nm embedded flash technology.

  For MPW schedule information, seat reservation and other more information, please contact Dejun_Wang@xmcwh.com.

  武汉新芯为客户提供多项目晶圆(MPW)服务,该服务使客户能够共享光掩膜板和工程硅圆片,从而降低产品设计制造的成本,为客户提供更有成本优势的晶圆服务。

  目前,武汉新芯的多项目晶圆服务技术工艺为55纳米低功耗逻辑,55纳米射频以及55纳米嵌入式闪存技术。

  关于多项目晶圆服务的进度信息、位置信息和其它更多信息,请邮件联系:Dejun_Wang@xmcwh.com