3D IC Platform
3D IC technology stacks multiple chips on wafer level, and uses semiconductor nano scale interconnect technology to connect multiple chips together. In addition to significantly reduce the chip area to achieve a shorter vertical interconnection, 3D IC technology can also improve the interconnection speed and reduce power consumption.
With the development of semiconductor technology, the needs of end market for small size, multi-functional and low-power chip continue to rise, reducing the size to improve the integration is gradually close to the limit, 3D IC chip will be the best choice to extend Moore's Law and to achieve multi-chip integration.
XMC began its technical layout of 3D IC technology in 2013, is the first manufacturer of image sensor using TSV technology. The shipments of image sensor chips have reached 600 million in 2016. Hybrid Bonding technology is the next generation 3D IC technology after TSV, with excellent design friendliness and portability. XMC's Hybrid Bonding technology has completed R&D and is about to enter mass production.